We return to [Tom Verbeure] hacking on Symmetricom GPS receivers. This time, the problem’s more complicated, but the solution ...

Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move ...

Fiber-optic cables are creeping closer to processors in high-performance computers, replacing copper connections with glass. Technology companies hope to speed up AI and lower its energy cost by ...

As the era of multi-chiplet designs looms, chiplet-to-chiplet interconnections become an important battleground as their ...

The Synopsys USR/XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, ... The ...

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Secondly, interposer PCB technology addresses signal integrity and power consumption issues. By utilising interposer technology, signal pins can be directly connected to the interposer layer, reducing ...

The accolade is the fourth award that POET has received in the past eight months. The others include the AI Breakthrough Award for “Best Optical AI Solution”, Global Tech’s “Best in Artificial ...

SAN FRANCISCO – Feb. 18, 2020 – Leti and List, institutes of CEA-Tech, reported a high-performance processor breakthrough using an active interposer as a modular and energy- efficient integration ...

Apple’s custom-built UltraFusion packaging technology uses an embedded silicon interposer that connects two M3 Max dies ...