And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...
Hosted on MSN1mon
Aehr Test Systems, Inc. (AEHR) Secures $10 Million AI Customer Order, Expanding Leadership in Wafer-Level Test Solutions for AI ProcessorsAehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: "With this ...
Meanwhile, there are other relative newcomers in fan-out, namely from China. For example, Jiangyin Changdian Advanced Packaging (JCAP) has a wafer-level package. JCAP is part of Jiangsu Changjiang ...
Hosted on MSN20d
Aehr Test Systems (AEHR): Pioneering AI Processor Testing with Wafer-Level Burn-In SolutionsAehr Test Systems, Inc. (NASDAQ:AEHR) is a leading designer, manufacturer, and seller of test and burn-in products for semiconductor devices in the wafer level, singulated die, and package part ...
and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback