EDN14h
A new platform for thermally stable DRAM peripheral transistors
Until 2018, DRAM peripheral transistors were predominantly made in planar logic MOSFET technology with poly-Si/SiO 2 or ...
Semiconductor Engineering15h
Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...
EDN20h
SoC interconnect automates processes, reduces wire length
With AI comes a compute performance explosion, and as a result, the complexity of interconnects is going to exponential ...