Configurability causes an explosion in verification complexity, but the upside is verification engineers are gaining in ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

A team led by the Cancer Immunogenomics group at the Josep Carreras Leukaemia Research Institute, the Computational Biology group at the Barcelona Supercomputing Center and the Germans Trias i Pujol ...

In a study published in Cell, a research team led by Zhu Shujia from the Center for Excellence in Brain Science and ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

AI accelerators are specialized hardware that are designed to enhance the performance of AI and ML applications.

And it does make me wonder whether all the hype around AI is obfuscating other significant developments in the electronics space. If you believe, as I do, that heterogeneous integrated packaging is ...

Multi-die technologies, tools, flows, and IP have matured rapidly. Engineering expertise has evolved. And foundry capacity ...

Athira Varma Jayakumar, a senior software engineer at DISTek Integration, has been named a judge for the Global Recognition ...

Abstract: The paper investigates the prescribed-time platoon control problem for heterogeneous vehicle systems under actuator faults and system uncertainties. The prescribed-time observer is presented ...

In an age when digital experience determines market success, website architecture has become a critical competitive advantage ...

We describe the architecture of Hetersdn, an SDN controller platform that supports a service-level model for application networking in heterogeneous networks in clouds.