Certain packaging materials can show 70% lower emissions than alternatives
A comprehensive assessment by researchers, including Rafael Auras from Michigan State University, sought to evaluate the ...
GlobalData on MSN17h
Siegwerk unveils NC-free ink for PE and PP packaging
The company's NC-free inks utilise proprietary polyurethane (PU) binders developed in-house, replacing NC. These binders are ...
siliconsemiconductor18h
EHD printhead promises semiconductor packaging revolution
Dr. Patrick Heissler, CEO, SCRONA AG, discusses the company’s recently unveiled 128-nozzle electrohydrodynamic (EHD) printhead, which achieves a three-digit nozzle count in digital EHD technology for ...
process-worldwide.com16h
3M Joins US-Joint Consortium to Accelerate Semiconductor Technology
The US-Joint Consortium is a strategic partnership of 12 leading semiconductor suppliers. 3M has now joined this consortium ...
Camtek Ltd.: Camtek Announces Record Results For The Fourth Quarter & Full Year Of 2024
Q4 revenues of $117 million; Q1 2025 revenue guidance of $118 -120 million, up ~23% YoY MIGDAL HAEMEK, Israel, Feb. 12, 2025 /PRNewswire/ -- Camtek Ltd. (NASDAQ: ...
Semiconductor Packaging News20h
Innovations Driving The Advanced Packaging Roadmap: Part Two
Summary Manufacturers are rethinking organic and glass substrate capabilities as advanced packaging pushes toward sub ...