Semiconductor Engineering4d
Innovations Driving The Advanced Packaging Roadmap: Part Two
Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.
AZoOptics on MSN7d
Creating ENZ Materials for Advanced Photonics
A novel method transforms common liquids into epsilon-near-zero materials using femtosecond laser pulses, enabling unique ...
Scientists achieve optical control of phase and group velocities in everyday liquids
The phase and the group velocity of light propagating in conventional optical media cannot exceed the speed of light in ...
Electronic Design8d
What’s the Difference Between Immersion and Direct-to-Chip Liquid Cooling?
The next generation of high-performance CPUs and GPUs targeting the demanding needs of AI and HPC will generate a significant ...
HHC Services LLC Highlights Advantages of Direct-to-Chip Cooling Fluid Over Traditional Methods
RIVERVIEW, FL / ACCESS Newswire / February 5, 2025 / With the increasing demands of data centers, the pursuit of effective ...
ITWeb on MSN18d
Electrocool: The liquid cooling revolution for data centres
Electrocool: The liquid cooling revolution for data centresIssued by Engineered FluidsJohannesburg, 28 Jan 2025Visit our press officeElectrocool promises a sustainable future for the digital age.
SciELO25d
Silica Deposition on Polyamide 6,6 Fabrics by Hybrid Corona-Dielectric Barrier Discharge Plasma
201100157 20 Cacot L, Carnide G, Kahn ML, Clergereaux R, Naudé N, Stafford L. Kinetics driving thin-film deposition in dielectric barrier discharges using a direct liquid injector operated in a pulsed ...