A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Infineon Technologies AG announces its 200 mm silicon carbide (SiC) manufacturing capability, with initial product releases ...

Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging ...

Critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; ...

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

Fiber internet needs to be fast. We always look at the packages that an ISP offers and ensure that line up with the most popular speeds that the average household would need. For example, tons of ...

The UAL Level 2 Award and Diploma in Art and Design has been developed to provide students with an interest in art and design with the opportunity to explore the materials, methods and processes that ...

The S-Rank Hunters used to be the showrunners of Solo Leveling until the Nation Level Hunters were introduced to the world. They are an elite set of hunters, each with power equal to that of an entire ...

As per the agreement, RRP Electronics – a company focused on assembling and testing semi conductor components – will use Deca’s cutting-edge wafer-level ... ASICs in QFN packages for a ...