And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?
The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...
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Aehr Test Systems, Inc. (AEHR) Secures $10 Million AI Customer Order, Expanding Leadership in Wafer-Level Test Solutions for AI ProcessorsAehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: "With this ...
Meanwhile, there are other relative newcomers in fan-out, namely from China. For example, Jiangyin Changdian Advanced Packaging (JCAP) has a wafer-level package. JCAP is part of Jiangsu Changjiang ...
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Aehr Test Systems (AEHR): Pioneering AI Processor Testing with Wafer-Level Burn-In SolutionsAehr Test Systems, Inc. (NASDAQ:AEHR) is a leading designer, manufacturer, and seller of test and burn-in products for semiconductor devices in the wafer level, singulated die, and package part ...
and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like ...
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