TSMC's quote for a 300-mm wafer process using its N2 technology ... of 10% to 15% (at the same power and complexity), while also cutting power consumption by 25% to 30% (at the same clocks and ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

The company uses molten silicon to form wafers rather than sawing ingots, thus eliminating dust waste and speeding up the process. A spokesperson for the company told pv magazine it is exploring ...