Flat aluminum (Al) and Gold (Au) is available for power device applications. Excellent corrosion resistance and satisfactory surface smoothness. Green tape indicates start of spool. Red tape is the end. 4N gold bonding wire in a range of diameters from 15um to 50um.

deliver homogeneous, high purity wire & ribbon with ultra clean surfaces and smooth finish. We offer gold bonding wire in a full range of diameters, suiting the needs for strength and hardness/elongation in your wire application. Coining also offers Au ribbon which is typically utilized in high-frequency microwave/RF and

Gold, Au, aluminum, Al, bonding wire and ribbon for use in microelectronics and RF/Microwave assembly, offered on half inch, 1/2" and two inch, 2" spools

We offer gold wire in a full range of diameters, suiting the needs for strength and hardness/elongation in your wire application. Diameters as small as 0.0005 inch (12.5 microns) as same as Gold Bonding Ribbon. We are extremely flexible with customization and offer a variety of different spool sizes.

TANAKA offers bonding wires and ribbons, such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al) ultra-fine wires (10 to 38µm) as metal bonding materials and thick wires (100 to 500um) for power devices.

Bonding of power is experiencing a rapid transition to aluminum ribbon for many reasons. Better electrical characteristics, improved heat dissipation, fewer bonds, improved throughput and reliability are some of the most obvious advantages.

TANAKA manufactures a full range of Gold (Au) , Silver (Ag), Platinum (Pt), copper and aluminum high grade wire for bonding purposes and special applications. Gold Ribbon Type AuR 25~250um width. Wide Gold Ribbon

TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor, defense and aerospace industry. TANAKA also offers a full range of Gold (Au), Silver (Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding.

QP Technologies (formerly Quik-Pak) performs wire bonding utilizing the latest automatic wirebonding equipment from K&S and Hesse. Wire diameters range from 0.6 mil to 2.4 mils for gold and aluminum. We also offer Copper and Silver wire, Wedge and Ball bonding, Ribbon Bonding and Heavy Wire.

Ribbon Bonding Au up to 50µm X 250µm ribbon. The larger surface area of the ribbon makes it an ideal interconnection option for high-speed RF applications and high-power devices. Explore wire bonding in semiconductor packaging to ensure optimal processes through collaborative design, maximizing yield.