A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins that can be put on a dual in-line or flat package.

Jan 5, 2024 · BGA packages are found on pcDuino and Raspberry Pi boards. Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT.

2000 Packaging Databook 14-1 Ball Grid Array (BGA) Packaging 14 14.1 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many.

BGA , or Ball Grid Array, is a kind of a surface mount package which is used in electronic products to mount integrated circuits such as microprocessors, FPGAs, WiFi chips etc.

Nov 23, 2022 · Using the underside of the IC package instead of connections around the edge makes it possible to reduce connection density, hence facilitating PCB layout. Using the underside of the chip prevents direct access to the connections, which makes soldering, desoldering, and inspection more challenging.

Jan 14, 2025 · BGA packages solve the problem of interconnecting complex ICs to printed circuit boards. Other interconnect approaches, such as peripherally connecting a chip using pins, are bound to have severe limitations in terms of connection density and reliability.

Dec 8, 2023 · BGA (Ball Grid Array): BGA packages have an array of solder balls on the bottom of the package, forming a grid. These solder balls provide electrical connections between the IC and the PCB. QFN (Quad Flat No-Lead): QFN packages have a …

Feb 1, 2024 · BGA (Ball Grid Array) packaging revolutionizes chip protection and heat dissipation in electronics. Unlike traditional methods, BGA arranges solder balls in a grid beneath the chip, offering controlled soldering and enhanced stability.

Feb 11, 2025 · Ball Grid Array or BGA is a surface-mount package (SMD Component) with no leads. This type of surface-mount packaging is used in Surface Mount Technology (SMT) and utilizes an array of metal spheres called solder balls for electrical interconnection.

HSBGA – BGA with heat spreader. FCBGA – flip chip BGA. CSBGA – cost saving BGA. FCHSBGA – flip chip BGA with heatspreader. FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface. LBGA : Low Profile Ball Grid Array. TEPBGA: Thermally Enhanced Plastic BGA. CBGA: Ceramic Ball Grid Array