New generation side-view optical BGA inspection system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components.

BGA inspection is a process where the connections between a chip and a PCB are analyzed to ensure quality. BGA inspections look at various aspects of the ball grid array, including the package’s standoff height, the quality of the connections and more.

Not only are the correct BGA inspection tools required, but a proper interpretation of the inspection criteria and standards is required by a trained and experienced inspector. BEST can be your BGA inspection resource.

What Is a Ball Grid Array Inspection? A BGA inspection is a meticulous process where you check the integrity of electronic assemblies. Modern BGAs consist of integrated circuits mounted on PCBs using an array of solder balls beneath the component.

The BGA X-ray inspection produces a top-down view of the component, allowing for a thorough examination of the solder patterns and ball grid. Utilizing a tilt function, more sophisticated X-ray inspection technology can examine solder junctions from various angles to determine their shape.

BGA Solder joint inspection is a process of visual and x ray examination of a solder joint. It is an important quality control method used to ensure the quality of the solder joints. It can be used to detect several defects such as cold solder joint, bridging …

Nov 11, 2020 · X-ray inspection for BGA. The BGA solder joint bonds are inspected using X-rays. The X-ray inspection helps to look through the device solder joint underneath the components. Due to this ability, the Automated X-ray Inspection (AXI) technology is …

The BGA/CSP ball inspection system inspects BGA and CSP devices for critical items such as coplanarity, ball presence, position, offset, pitch, extra ball, body width, ball damage and

Dec 21, 2023 · BGA inspection is a process where the connections between a chip and a PCB are analyzed to ensure quality. BGA inspections look at various aspects of the ball grid array, including the package’s standoff height, the quality of the connections and more.

Jan 16, 2025 · Currently, the industry commonly uses three main methods for inspecting BGA solderability: X-Ray Inspection; Red Dye Penetration Test; Micro-sectioning (Cross-section Analysis) Of these, only X-ray inspection is non-destructive. Therefore, it’s highly recommended to always start with X-ray inspection when analyzing BGA solderability.