Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines Dicing Saws

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers ...

Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines Dicing Saws

Dicing saws for dicing grinding service. High quality dicing with DISCO dicing blades

Dicing saws for dicing grinding service. High quality dicing with DISCO dicing blades

Shop a wide selection of Disco Dicing Saws on LabX. Find new and used pricing to meet your lab needs. Choose from top brands in our marketplace.

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment.Investor relations, careers ...

We can dice substrates smaller than a millimeter square up to 300mm diameter wafers using DISCO’s unrivaled dicing saws and blades.

DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non …

Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines Dicing Saws

Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO’s precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.

Dicing bumped wafers or dicing sapphire substrates, Disco dicing saws and dicing blades deliver excellent results. With facilities on the East and West coasts, difficult dicing requirements for all materials can be processed with extremely short lead-times.

DAD3221 is a single-axis dicing saw which achieves processing of workpieces up to Φ6 inches as a standard, and 150 x 150 mm with a user-specified specification. Has the world’s smallest footprint * (width: 490 mm x depth: 870 mm) through the small footprint design.

DFD6341 is the latest fully automatic dual spindle dicing saw for Φ8-inch wafers, incorporating the throughput enhancement technology developed in DFD6362 for Φ300 mm wafers. Adoption of a uniquely developed axis mechanism enables X-axis return speeds up to 1,000 mm/s.

Make: Disco Model: DAD3231 Year: 2020 Machine Location: Upon Request Stock #: 792136

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Single-axis dicing saw which is compatible with the 6 x 6-inch workpiece using a user-specified specification. Improved usability and performance. Each model features an LCD touch panel with a graphical user interface for easy and intuitive operation.

The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.

By optimizing the frame structure and handling section layout, the footprint is on par with that of DISCO’s semi-automatic unit (DAD3350), even though it is equipped with all the functions of a fully automatic unit (size reduced by about 20% from the DFD641).

Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. Precision Machines Dicing Saws