A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors . A BGA can provide more interconnection pins that can be put on a dual in-line or flat package .

The flip chip BGA package outline drawing provides important mechanical design data, including package dimensions (length, width, and thickness) and solder ball number, size, and pitch.

Jan 18, 2025 · FCBGA (Flip-Chip Ball Grid Array) is a high-performance BGA packaging, widely used for CPUs and GPUs. Originating from IBM, it excels in EMC/EMI, I/O density, and heat dissipation. FCBGA, despite manufacturing challenges, offers improved reliability and efficiency compared to traditional BGA.

Many Freescale high performance products require the performance advantages of a flip chip Ball Grid Array (BGA) package. Flip chip packages are offered in bare die, flat lid and full lid configurations. Package BGA pads are soldermask defined. "Pkg SM Diam" is the BGA pad soldermask opening.

Mar 12, 2024 · An FC-BGA Substrate (Flip-Chip Ball Grid Array Substrate) is a high-density interconnect substrate used in advanced semiconductor packaging. It serves as a critical component in Flip-Chip BGA packaging, providing mechanical support, electrical connections, and thermal management for flip-chip-mounted devices.

FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.

FC-BGA is short for flip chip ball grid array. Similar with CBGA in terms of structure but with BT resin used to replace ceramic substrate, FC-BGA saves more cost. Moreover, flip chip is capable of shortening internal circuit pathways, effectively improving electrical performance.

FC-BGA substrates are semiconductor packages with fine design rule and high reliability. Kyocera provides IC packages with more than 3,000 I/Os, and which comply with next generation flip-chip LSI utilizing cutting-edge design rule and state-of-the-art processing technology.

Amkor Flip Chip BGA (FCBGA) packages are assembled around state‑of‑the‑art, single unit laminate or ceramic substrates. Utilizing multiple high density routing layers, laser drilled blind, buried and stacked vias, and ultra fine line/space metallization, FCBGA substrates have the highest routing density available.

Oct 18, 2022 · What is the difference between a flip chip and BGA? Even though a FCBGA is often confused with BGA, they are both different from each other. The primary difference between a FCBGA and a normal BGA is the use of a flip chip die and it is internal to the whole package.