A field-programmable gate array (FPGA) is a type of configurable integrated circuit that can be repeatedly programmed after manufacturing. FPGAs are a subset of logic devices referred to as programmable logic devices (PLDs).

Dec 17, 2018 · Silicon die – This is the FPGA silicon wafer that has been sawed into a single die. The wafer is produced in a wafer foundry. Bumps – Those are tiny solder balls connecting the silicon die to the BGA substrate. bumps are distributed across the entire the chip and not only located on the die edge, pads can be placed all over the surface of ...

My research group wants to fabricate a sensor that would rest on top of a Xilinx FPGA package, and detect when and where the IC is being struck by high-energy particles (this is for a radiation-tolerant computer application). To make this work, we need to know the actual physical size of the IC inside the package.

Core fabric die. This is the main FPGA die, which contains the basic logic resources, and is available in various sizes and grades. All Agilex™ 7 devices have a single core fabric die. Transceiver die. Transceiver dies are offered in four types: H-Tile, E-Tile, F-Tile, and R-tile.

Jul 1, 2011 · Let’s start by considering the simplest possible FPGA fabric, which can be visualized as comprising “islands” of programmable logic in a “sea” of programmable interconnect – all of which is implemented on a single silicon die as illustrated in Fig. 1.

Mar 7, 2025 · Instead of basing the FPGA on a single large monolithic die, SSI combines multiple smaller dice that can be produced at a much higher yield that allows continued scaling of device capacity without surging part costs.

Jun 19, 2024 · Interposer-based 2.5D FPGAs contain multiple dies interconnected through external wires. While essential for increasing capacity, these external connections introduce higher delays and longer wirelengths. Efficient placement tools are needed for such architecture to strategically manage signal counts at the die boundary.

Mar 4, 2025 · Some serial NOR flash vendors reach larger densities by stacking die in the same package. For use with UltraScale architecture-based FPGAs, these types of devices must offer a transparent interface and read behavior to the FPGA. UltraScale architecture-based FPGAs do not support single flash devices that use multiple s...

Die-To-Die Case Study •Single-die design is 60 FPGAs, requires a modular implementation flow for fast, predictable build times. •Need to contain compute, storage resources. •Many copies of the single die design to be deployed. •Very few dual die designs to be deployed. •Want a single implementation project/flow for both scenarios.

In an integrated circuit, a die is a small piece of semiconductor material on which a given functional circuit is fabricated.