JU-50P is an SMT adhesive designed for printing, capable of achieving a good printed shape regardless of the pattern. It maintains minimal viscosity changes even during continuous use, …

We offer products that cater to the diverse needs of the electronic devices around you. Search for technical articles on soldering processes and recommended products using the keywords. We …

JU-110-3 is designed for general application use and supports micro-components such as 0402 metric (01005) chips and high-speed dispensing. It offers excellent shape retention with …

KOKI Dispensing type adhesive with no infringement of UN regulations Improved application precision No Un-regulated hazardous substances has excellent shape retention, enabling …

Printing Adhesive JU-50P achieves a consistent stencil release property regardless of the pattern size and shape. It also secures stable print shape during continuous use. Product outline: …

KOKI SMT Adhesive for Dispensing JU-110-3 has Advanced storage stability and Applicable to fine pattern dispensing for components.

Here we offer KOKI Adhesive with excellent properties during the process as well as after soldering. The SMT adhesive is a red glue used during the SMD process to avoid the …

Multi-purpose printing adhesive with consistent workability Applicable to various printing patterns From large patterns to small patterns, a consistent stencil release property is achieved.

Measure the diameter and height of 5 dispensed adhesive dots using a digital microscope at the beginning and every 2500 shots on the PCB. Take their average and plot in the graph. JU-110 …

Print (knead) Adhesive on the sealed-up stencil continually up for 24 hours to observe viscosity variation. ・Squeegee : Metal blade, Angle - 60° ・Squeegee speed : 30mm/sec. ・Print …