JU-50P is an SMT adhesive designed for printing, capable of achieving a good printed shape regardless of the pattern. It maintains minimal viscosity changes even during continuous use, ensuring stable printing performance and consistent bonding strength.

We offer products that cater to the diverse needs of the electronic devices around you. Search for technical articles on soldering processes and recommended products using the keywords. We analyze the provided PCBs to identify the causes of defects and assist our customers in achieving optimal performance.

JU-110-3 is designed for general application use and supports micro-components such as 0402 metric (01005) chips and high-speed dispensing. It offers excellent shape retention with minimal heat slump during curing, maintaining height and a stable deposit shape throughout continuous use. 130ºC, >60sec.

KOKI Dispensing type adhesive with no infringement of UN regulations Improved application precision No Un-regulated hazardous substances has excellent shape retention, enabling continual application of tall print deposits.

Printing Adhesive JU-50P achieves a consistent stencil release property regardless of the pattern size and shape. It also secures stable print shape during continuous use. Product outline: Printing application adhesive to hold down surface mount devices prior to soldering; Stable dispense shape during continuous use; Fine pattern printing available

KOKI SMT Adhesive for Dispensing JU-110-3 has Advanced storage stability and Applicable to fine pattern dispensing for components.

Here we offer KOKI Adhesive with excellent properties during the process as well as after soldering. The SMT adhesive is a red glue used during the SMD process to avoid the displacement of components until they are soldered.

Multi-purpose printing adhesive with consistent workability Applicable to various printing patterns From large patterns to small patterns, a consistent stencil release property is achieved.

Measure the diameter and height of 5 dispensed adhesive dots using a digital microscope at the beginning and every 2500 shots on the PCB. Take their average and plot in the graph. JU-110-3 maintained stable shape throughout the continuous dispensing test.

Print (knead) Adhesive on the sealed-up stencil continually up for 24 hours to observe viscosity variation. ・Squeegee : Metal blade, Angle - 60° ・Squeegee speed : 30mm/sec. ・Print stroke : 300mm ・Printing environment : 21.0~25.0ºC ・Viscosity : PCU-205, Malcom 10rpm, 25ºC ・Bonding Strength : See “Cure condition / Strength”