Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can …

Jan 28, 2021 · Chemical mechanical polishing (CMP) is widely accepted as the best planarization technique for fabricating nanoscale devices. A soft CMP pad that can enable higher oxide …

This document is intended to introduce the techniques of Chemical Mechanical Polishing (CMP) to the new user so that they may be better prepared to integrate CMP into their process flow.

Combing the capabilities of micro- and macro-scans, as well as lower measurement times, HRP is highly qualified to provide in-line characterization of post-CMP topography, such as via recess, …

Blanket wafer Removal Rate and defectivity data have been collected from slurry candidates being considered for next generation SIF oxide CMP processes. Further development is …

半導体デバイスのCMPによる製造プロセスにおいて、広義には、絶縁膜のCMPプロセス全般を、狭義にはそのうち層間絶縁膜のCMPプロセスのことをいう。 各膜を成膜した後、表面の凹 …

Currently, implementation of metal subtractive interconnect scheme is hampered by the availability of an optimized chemical mechanical planarization (CMP) process. Focus of the …

Field oxide loss is defined as the amount of oxide lost in regions with no metal pattern or very low metal pattern density. This loss is typically small for a well controlled process due to a very …

Abstract: The cost of many 300mm CMP consumables has decreased in recent years due to a maturing market and new process learning, making it economically feasible to embark on a …

Summary This chapter contains sections titled: The Role of Chemistry in Oxide Polishing Oxide CMP in Practice summary