The MM-1 Mini Mirror is a great tool for PCB rework and prototype printed circuit board assembly. The MM-1 Mini Mirror allows the user to inspect solder joints of a BGA component before and after the reflow at the BGA rework process.

The Metron BGA MiniMirrors (I84-BGA or I86-BGA) are specially designed to inspect both the outer and inner rows of the Ball Grid Arrays. These MiniMirrors are self standing or hand held and are mounted on a flexible telescopic wire shaft.

Real time view of BGA inspection, capturing defect image for documentation, and performing dimensional measurement on BGA ball size and pitch, all with better image clarity and less expensive than X-ray system. 1080p HD 6MP camera for real-time HD image inspection; 3D rotational mirror to see BGA side view in real time 3D

The Mini Mirror inspection tool allows the user to inspect solder joints of a BGA component before and after the reflow/rework process. This will permit the operator to visually inspect the outer row of solder spheres to properly inspect the solder point.

BGA Hand Mirror for Inspecting BGA Solder Joints. Self-Standing on the PCB or Handholding; Small and Thin Mirror for Populated PCB; Mirror Reflecting for Inspecting BGA, Connector, Joint’s Heel, and Underneath Component at 90º View; Work Best with LX-100 and 3D Rotational Viewer; Work with Regular Microscopes

The Mini Mirror inspection tool allows the user to inspect solder joints of a BGA component before and after the reflow/rework process. This will permit the operator to visually inspect the outer row of solder spheres to properly wet the solder point.

The Metron BGA MiniMirrors are specially designed to inspect both the outer and inner rows of the Ball Grid Arrays. These MiniMIrrors are self standing or hand held and are mounted on a flexible telescopic wire shaft.

The I84-BGA is excellent to inspect the inside of Ball-Grid Arrays. This mirror is hand-held and self-standing. The replaceable mirror shank (I84-BGA-NH) offers a flexible/bendable shank. The I84-BGA Mirror measures 0.754" long x 0.190" wide.

The BGA Inspection Mirror allows the user to inspect solder joints of a BGA component before and after the reflow/rework process. This will permit the operator to visually inspect the outer row of solder spheres to properly wet the solder point.

Use with your existing microscope or video inspection system for inspecting BGA solder joints; Simply place along side of BGA components and you are ready to inspect; Offer 90 degree view into BGA solder joints; Adjustable tilting angles for mirror; Good for inspection J-leads, connectors, and 90 degree view of fine pitch